ROLE PURPOSE:工作描述:Interface and facilitate engineering engagement, technical representation with potential new customers for new package and device qualification.Understand the customer specifications and verify the Assembly Process capability to ensure finish product complies as per customer requirement.Define members of a cross functional team from Process Engineering, Production, Quality Assurance and NPI Team to ensure smooth transfer from design conceptualization, prototyping, qualification builds, pre-production to full HVM.Collaborate with Design team for new device, package and perform Technical Risk Assessment to work a mitigation plan with Process Engineering and NPI Engineering team.Provide immediate assistance to any technical information as required by customers thru their inquiries.Drive and manage NPI engineering ****uation, qualification to meet project timeline in coordination with cross functional teams.Responsible to track daily status of customer projects and key issues.Ensure constant feedback on project milestones thru regular conference calls and/or face to face meetings with customers.工作描述:? 與潛在的新客戶進行交流并促進工程參與和技術代表，以進行新封裝和設備認證。? 了解客戶規(guī)格并驗證裝配工藝能力，以確保成品符合客戶要求。? 從工藝工程、生產、質量保證和NPI團隊中定義跨職能團隊的成員，以確保從設計概念化、原型設計、資格認證構建、預生產到完整HVM的順利過渡。? 與設計團隊合作開發(fā)新設備、封裝并執(zhí)行技術風險評估，以與工藝工程和 NPI 工程團隊合作制定緩解計劃。? 根據(jù)客戶的詢問，對客戶所需的任何技術信息提供即時幫助。? 與跨職能團隊協(xié)調，推動和管理 NPI 工程評估、資格認證以滿足項目時間表。? 負責跟蹤客戶項目的日常狀態(tài)和關鍵問題。? 通過定期電話會議和/或與客戶面對面的會議，確保對項目節(jié)點的持續(xù)反饋。 KEY TASKS & RESPONSIBILITIES:工作職責:Technical skills and knowledge on assembly packaging.Lead project for New Product Introduction.Review the new device, package design of customer’s enquiries.Plan and organize assembly ****uation for New Product IntroductionPrepare presentation material and compiled technical assembly report for the project.New Project execution thru APQP methodology and update/upload in eNPI system. 主要任務和職責：工作職責:? 裝配封裝方面的技術技能和知識。? 領導新產品導入項目。? 審查新設備、包裝設計的客戶咨詢。? 計劃并組織新產品導入的裝配評估。? 為項目準備演示材料和編制技術組裝報告。? 通過APQP方法執(zhí)行新項目，并在eNPI系統(tǒng)中更新/上傳。 JOB REQUIREMENTS:任職資格:Bachelor’s Degree in Electronics, Electrical, Mechanical Engineering or related engineering discipline.Over 5 years working experience in related processes in high volume electronics manufacturing environment preferably semiconductor.Knowledge in APQP, DOE, SPC, FMEA and MSA.Apply full understanding of engineering principles in performing job responsibility.Good command in both spoken and written in English and Chinese / Mandarin.Knowledge in Microsoft Office.Able to work with cross functional team and with minimum supervision.Effective interpersonal and communication skills.任職要求：任職資格:? 電子、電氣、機械工程或相關工程學科的學士學位。? 5年以上大批量電子制造環(huán)境相關工藝工作經(jīng)驗，最好是半導體。? 了解APQP、DOE、SPC、FMEA和MSA。? 在履行工作職責時充分理解工程原理。? 良好的中英文/普通話口語和寫作能力。? 了解 Microsoft Office。? 能夠與跨職能團隊合作，具有工作自主性。? 有效的人際關系和溝通技巧。

As a independent group of companies offering test & assembly services for a broad range of integrated circuits including memory, mixed-signal, analog, logic and memory. 聯(lián)測優(yōu)特作為半導體封裝測試行業(yè)全球排名前列的企業(yè),UTAC集團在集成電路，模擬混合信號，邏輯無線電頻率集成電路IC等相關業(yè)務范圍內占有其獨立的一席之地。 UTAC Yantai offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising integrated device manufacturers (IDMs), fabless companies and wafer foundries. 公司提供種類齊全的封裝測試研發(fā)，為客戶提供生產制造的相關服務及解決方案，其全球范圍內的客戶包括完善的設備制造廠，無生產線的公司以及硅片鑄造廠等等。